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| Kho Young > SB-3000 Series |
SB-3000 significantly reduces defects adopting a market proven technologyof our KY-3030 series. Using the fast and accurate 3D profilometry substratebump inspection system, SB-3000 can inspect smallest substrate bumps andsuper fine pitches, detecting defects of all kinds which may occur during theminute process. |
Features
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Optimal solution for the Substrate Bumped device.
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Solution for No Shadow & No Specular Problems
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Extracting solder bump volume only
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Robustness against surface Warping.
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User Convenience System: Windows XP OS / Real-time OS.
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Various type of defects Measurement not only Excessive, Insufficient, Deformity, Missing Bump but also Shape error, Bridge, Displacement, Particle, Co-planarity
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