-	Cassette to Cassette Die Sorting System
1.	DS9000
	Transfer 300 to 200mm wafer frames
	Sorting from Wafer to Wafer, Waffle-Pack/Gel-Pack and Tape&Reel
	LED wafers output to 32 bins
	Wafer to Die Trays
	Vision inspection of devices
	Pick and Place at up to 9000 uph
	Die as small as 200µm square
	Large µ Processor die over 25mm square
	Electronic wafer map input
	25 level wafer cassette input
	25 level frame cassette output
	Edge Chip and 2D Bump inspection
	Standard 255 bin categories
	Windows® XP
	Network Ready LED Wafer Processing
	Pick up to 32 bins and transfer to film frames
	Adaptive wafer alignment and die pitch correlation software
	Vision inspect for doublets and die chips / cracks
-	High Speed Die Sorter for WLP and other Flipped Devices into Tape and Reel
2.	CS1250
	Throughput: 16,000 UPH
	Footprint: 1.95m2 (1.65m W x 1.16m D)
	Placement Accuracy: 25µm@3s
	Wafer Size: 300mm standard, 200mm capable
	Die Size: 0.5mm X 0.5mm to 12.5mm X 12.5mm
	Tape Width: 8mm to 24mm
	Automatic tape load and tape width adjustment
	Automatic calibration and drift correction
	Single touch screen Graphical User Interface
	2D Vision inspection for bump damage, edge chips, lasermarks, surface defects and tape seal
-	Wafer to wafer Die Sorting for class 100 clean rooms.
	DS9-100
	Automatic load, offload of tape frames in cassette
	Generate 200mm wafers from 300mm wafers
	Top surface and backside inspection
	Quick Setups/Changeovers
	Wafer Mapping/Ink Dot Recognition
	Wafer Stretching
	Windows® XP Operating system
	Meets CE Mark and SEMI S2 Specs
-	LED sorter with integrated vision inspection.
	DS11000
	LED sorting into 148 bins
	Pick and place at over 11000 parts per hour
	Dynamic vision mapping of each wafer
	Automated cassette handling of wafers and bin frames
	Whole and partial wafers up to 6 inch diameter
	Vision inspection of each LED before picking and after placement
	Devices as small as 150µm square
	Die tracking data for each offloaded frame
	Network mapping and tracking data with host system