Datacon has concentrated on the advanced packaging market since 1986, focusing on die bonding and flip chip technologies. Datacon leads the way in these markets, guaranteeing our customers a future-oriented, customized solution. Don't be content with anything else!

The flip chip market will experience extraordinary growth rates in the next several years - and Datacon is prepared for its take-off into high volume. With a large flip chip installed base, Datacon - the flip chip pioneer from the very beginning - proudly presents to you the powerful 8800 FC high-speed, high-accuracy platform for a wide range of flip chip processes.

The powerful 8800 FC platform is not just an upgrade - it's a complete new machine generation for high volume flip chip production. Based on Datacon's expertise gained from many years of experience, the 8800 FC platform will revolutionize the flip chip market.