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multi chip Setting standards in die attach      
         
 

As one of the leaders in die attach for more than two decades, Esec is committed to surpassing its customers' needs by constantly setting new industry standards in die attach. With its latest die attach platform, the revolutionary Die Bonder 2100 xP, Esec demonstrates once more its innovation strength.

 
         
         
  Die Bonder 2100 sD   Die Bonder 2100 sD  
       
  Redefining Stacked Die Bonding    
       
 

The newly developed Esec Die Bonder 2100 sD offers a wide range of benefits with the sole target of producing highest quality at lowest cost per die placement. Special handling and operating aspects of stacked die are incorporated in the revolutionary machine concept. Redefining Stacked Die Bonding. For your benefit.

   
         
 
  15 µm Accuracy @ 3 Sigma (film based applications)
multi chip Revolutionary Phi-Y pick and place
Stable high accuracy thanks to vibration control
   
  Widest Application Range
multi chip From epoxy to most advanced stacked die applications
(amongst others BGA, CSP-BGA, SiP-BGA, FBGA)
multi chip Patented ultra thin die pick up solutions
multi chip 50 N bond force standard
multi chip Up to 125 mm substrate width
   
 
Shortest Time to Yield
multi chip Recipe transfer from machine to machine
multi chip Operator independent results due to auto calibration concept
multi chip Tool-less exchange of expansion unit in less than 30 seconds
   
  Highest Up Time
multi chip 4 live camera pictures on display at all time
multi chip Strip and magazine viewers
multi chip Online help
multi chip Easy maintainability
   
  Platform of the Future
multi chip Third process station for additional process expansions
multi chip Expandable for the future thanks to revolutionary machine concept
 
Die Bonder 2100 sD
 
Die Bonder 2100 sD
 
 
 
 
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