NMtronics- Semi Conductor Divison

The Die Bonder 2008 hSplus is the successful combination of speed and reliability of the proven high-volume 2008hS platform with the flexibility and accuracy of the award-winning high-end 2008 xP platform.

The ultra fast vision system together with the enhanced Pick & Place enable production runs of 13,000 units per hour. The 2008 hSplus is the ultimate epoxy die bonder with regards to handling metal lead frames, substrates, thin die, stacked die and wafer back side lamination. Of course this bonder family handles high-end applications on BGA substrates and " to 12" wafers.
The intelligent set-up procedure guarantees repeatable constant bonding quality while the ergonomic human-machine interface (HMI) with its user-friendly graphical user interface GUI makes operating this equipment a real pleasure

Features

Highest speed at highest accuracy

In addition to the drastically increased speed of the new 'pick-and-place', the Die Bonder 2008 hSplus features an improved control system and a new ultra-fast vision module. These cutting edge features enable the highest accuracy imaginable. The incredible accuracy does not interfere with the tremendous speed. Even when making use of the optical bond centering, a staggering production rate of 10,000 units per hour is reached - whereas 13,000 units per hour (UPH) can be achieved with high-volume production runs.

Application range

The Die Bonder 2008 hSplus offers the widest application range that one can ask for. Be it discrete epoxy packages with small dies, QFN or large dies on BGA substrates. Wafer size is no issue, since the 2008 hSplus handles up to 300 mm.
The flexible 2008 hSplus combines unbelievable productivity rates with highest quality levels.

Process capability

The ever-changing technology requirements within the back end segment necessitate equipment with the highest degree of flexibility and the capability to handle new processes. The Die Bonder 2008 hSplus offers all that and more. Take for example wafer backside lamination, thin die and stacked die - to name just a few!