Die Bonder 2100 xP, Esec Die Bonder, Esec india, BE Semiconductor Industries N.V., Die Bondering india, India

Revolutionizing Die Attach

The new epoxy Die Bonder 2100 xP is the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.

Redefining Stacked Die Bonding

The newly developed Esec Die Bonder 2100 sD offers a wide range of benefits with the sole target of producing highest quality at lowest cost per die placement. Special handling and operating aspects of stacked die are incorporated in the revolutionary machine concept. Redefining Stacked Die Bonding. For your benefit.

	Leading Edge Machine Concept
	3 fully decoupled process stations allow to handle any substrate up to 300 mm length without any restrictions
	Reloading of material from the front while machine is in full operation
	Key alignment tasks performed by cameras make many mechanical adjustments obsolete

	Highest uptime
	Real time process monitoring through 4 live images of process zones
	Constant status control with real time wafer, strip and magazine viewer
	Efficient learning and error recovery thanks to context sensitive online help

	Highest speed at 20 µm accuracy
	167 ms pick & place cycle time due to the revolutionary Phi-Y mechanism combining rotational with linear movements
	Placement accuracy of 20 µm (3 sigma) through vibration control
	Highest stiffness for highest speed AND accuracy

	Fastest time to yield
	Toolless exchange of product specific parts for fastest product changeovers
	Teach and setup wizards and parameter teach verification eliminate setup errors
	Recipe transfer from machine to machine enables fast conversion

	The Platform of the Future
	Handles all high-end epoxy processes on strip for substrate lengths up to 300 mm
	50 N bondforce standard
	Third process station enables easy adaptation to future leading-edge applications