The molding and trim & form process is part of a fast and innovative international market where Fico has taken the lead in molding specialized memory packages. While leadframe based packages such as the SO and TSOP with straight or gullwing shaped leads are still the optimal solutions for memory packages, radical changes have been taking place in this area of the packaging process. A wide variety of array connect packages such as CSP, flip chip, BGA, BOC, MBGA, flexBGA, bottom lead packages and others offer significant miniaturization potential, with customized carriers and unique processing requirements. Since packaging has become more application specific Fico offers you the best solution for your requirements.

The Fico process technology and engineering department are ready to assist you in the design of your package and leadframe, in optimizing your process parameters, process reliability and process costs and in selecting the most suitable solution of the below listed systems for your application.

Fico is very experienced in manufacturing molding and trim & form systems for power device packages.

Examples are SIP, PFP, PDSO, PSO, HSOP, TO-220, D-pack and HIQUAD. Both single and matrix leadframe design are supported. Our expertise in this field offers you innovative and cost effective solutions. High density leadframe power packages with heatslugs for instance are an evolution in mold design. A laser deflasher can be easily integrated into the trim & form system to remove flash or bleed from the heatpad area.

The Fico process technology and engineering department are ready to assist you in the design of your package and leadframe, in optimizing your process parameters, process reliability and process costs and in selecting the most suitable solution of the below listed systems for your application.

The Fico mold and tool design enables molding, trimming and forming of high volume discrete packages at low cost.

The many different shapes of discrete packages present their own unique challenges. Diodes, capacitors, transistors, and thyristors each have their own specific requirements. These discretes can be molded on single or matrix leadframes, as well as on endless strips on reels. Fico offers solutions for leaded and leadless products, and supplies molding and trim & form systems for a considerate variety of discrete packages.

The Fico process technology and engineering department are ready to assist you in the design of your package and leadframe, in optimizing your process parameters, process reliability and process costs and in selecting the most suitable solution of the below listed systems for your application.

Fico has the technology and know how to mold, trim & form any type of logic package.

Considerate changes are taking place in the packaging process. A wide variety of array connect packages such as CSP, flip chip, BGA, QFN in Matrix or in Map, bottom lead packages and others, offer significant miniaturization potential. Customized carriers and unique processing solutions are part of our innovative process. For any kind of logic package type Fico has a solution.

The Fico process technology and engineering department are ready to assist you in the design of your package and leadframe, in optimizing your process parameters, process reliability and process costs and in selecting the most suitable solution of the below listed systems for your application.

Transfer overmolding of smartcard chip modules as compared to glob top molding has the advantage of high quality, low height, and totally identical packages.

Fico has optimized leadframe leadframe, mold and system design to ensure a minimum of epoxy waste. Leadframe widths can be maximized up to 70 mm and this can be split into two 35 mm frames after molding, making it possible to use existing equipment in the next assembly process steps. To singulate the individual smart card chip modules our Reel-to-Reel Fico Compact Line has proven to be an excellent solution.

The Fico process technology and engineering department are ready to assist you in the design of your package and leadframe, in optimizing your process parameters, process reliability and process costs and in selecting the most suitable solution of the below listed systems for your application.

Fico is leading in the market of clear compound molding. The trim & form systems for strip as well as for reel to reel based applications are an excellent choice for isolation of products like leds, optical sensors, CMOS/CCD's or any other package with lenses.

The Fico process technology and engineering department are ready to assist you in the design of your package and leadframe, in optimizing your process parameters, process reliability and process costs and in selecting the most suitable solution of the below listed systems for your application.

Fico offers excellent molding and trim & form solutions for System in a Package (SiP), developed for automotive, telecom and other applications.

A wide variety of dedicated products can be handled on the various Fico systems. Depending on the product type different mold and tool lay-out designs are possible.

The Fico process technology and engineering department are ready to assist you in the design of your package and leadframe, in optimizing your process parameters, process reliability and process costs and in selecting the most suitable solution of the below listed systems for your application.

The transfer molding technique, as used in the semiconductor industry is proving to be an ideal solution for other applications such as devices found in the automotive industry.

Devices can be molded on a leadframe type carrier. The non semiconductor application is a new and growing market in the molding industry and offers unlimited possibilities. When devices are is a leadframe type carrier, our trim & form or singulation systems can be used to singulate and/or form the leads of non semicon applications like sensors, multi media cards, etc.

The Fico process technology and engineering department are ready to assist you in the design of your package and leadframe, in optimizing your process parameters, process reliability and process costs and in selecting the most suitable solution of the below listed systems for your application.

Fico has the ultimate solution for depaneling of any type of product. Especially depaneling of PCB or BGA products a unique solution can be found by using different kinds of lasers.

The Fico laser beam creates a very small cutting width for depaneling. As a result, the original lay-out of the panel can be optimized, creating a higher density. The Fico process technology department will help you out in finding the optimal solution.

Different products (materials) require a different laser. For PCB material, typically a CO2 laser is used. Other possible laser solutions are:

Any shape can be depanelised, no matter how complex its perimeter. The Fico process technology and engineering department are ready to assist you in the design of your package and leadframe, in optimizing your process parameters, process reliability and process costs and in selecting the most suitable solution of the below listed systems for your application.

Saw Isolation, isolates each product using a saw. Since only the wires are cut, the prodcts can then be tested in the strip. Laser Singulation then finalizes the singulation process by cutting out each individual product.

The Fico process technology and engineering department are ready to assist you in the design of your package and leadframe, in optimizing your process parameters, process reliability and process costs and in selecting the most suitable solution of the below listed systems for your application.