NMtronics- Semi Conductor Divison




	Meco offers a number of different system solutions for leadframe plating . The figure below shows the total "leadframe production flow" and the system solutions of Meco. Furthermore, the other process steps like Die attach, Bonding, Unit inspection, Molding, Singulation and Trim & Form system solutions are being offered by the other Besi group members! After stamping or etching, the leadframe needs to be silver plated (spot) to enable die attach and wire bonding. Depending on speed and accuracy there are two ways to apply the selective silverspot onto the leadframe, by means of mechanical masking or by photoresist masking.
	If you need high speed , then Meco RTR Ag plating systems are the solution. When you focus on very high accuracy then Meco ACP plating system is the answer! After molding, some of the mold residue (resinbleed) might get stuck on the leadframe. Especially on the functional areas, such as heat-sinks and between leads, no flash is allowed otherwise they don't get solder plated. To remove this thin flash before solder plating we can offer our Meco EDF systems which can operate standalone or can be integrated into the Meco EPL solder plating system.