Meco offers wafer plating equipment for advanced packaging. There are many forms of advanced packaging, including flip chips, wafer level chip-scale packages, stacked dies and chip-to-wafer packages. More packaging continue to be developed by todays's leading semiconductor manufacturers. They look for more reliable and cost-effective ways to deliver faster and smaller chips with increased functionality.

Meco is dedicated to help these companies find more reliable and cheaper process solutions. Reliable and cost-effective means, we believe, simple solutions , straight forward processes and user-friendly production equipment. We identified two processes that enable new solutions and easier implementation.

Electrophoretic resists is the easiest and cheapest method to cover high topographies in or on the silicon wafer with a uniform layer of photoresist. Several companies are now using our dedicated tool, the Meco EDRC , for production of through-wafer interconnects.