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  Damage-free Megasonic and Chemical Cleaning  
Wafer Mask Cleaners
 
Wafer Mask Cleaners
 
       
 

APPLICATIONS:

   
       
Patterned or Un-patterned Wafer Cleaning
Ge, GaAs and InP Wafer Cleaning
Post CMP Wafer Cleaning
Cleaning of the Diced Chips on Wafer Frame
Cleaning after Plasma Etching or Photoresist Stripping
Cleaning after Lapping and prior to Bonding
Cleaning of X-ray Masks, EUV Masks, Templates
Pelliclized Reticle Cleaning
Cleaning  of Mask Blanks
Cleaning Contact Masks
Cleaning of the ITO coated Display Panels
Cleaning of Ceramic Substrates w/ laser drilled holes
Optical Lens Cleaning
Megasonic agitation to enhance  Lift-off Process
   
 
       
       
         
 
SWC-3000 Standard Table-top Model

Megasonic Cleaning
Spin Dry with N 2

SWC-3000-C Table-top with CDU

Megasonic Cleaning
Spin Dry with N 2
Chemical Dispense Capability

SWC-3000-M Table-top for mask cleaning

Megasonic Cleaning
Spin Dry with N 2 /IR Lamp dry

SWC-4000 Standard Stand-alone model

Megasonic Cleaning
Spin Dry with Heated N 2
Chemical Dispense, Acid&Solvent Separate Drain

SWC-4000-M Stand-alone Mask Cleaner

Megasonic Cleaning
Spin Dry with Heated N 2
Chemical Dispense, Acid&Solvent Separate Drain

SWC-4000-MP Pelliclized Reticle Cleaner

Megasonic Cleaning
Spin Dry with Heated N 2
Chemical Dispense, Acid&Solvent Separate Drain

 
     
  ADDITIONAL OPTIONS :  
 
Brush Cleaning
Ozonated DI Water (20 ppm)
Hot DI Water Flush
Heated Nitrogen
Nitrogen Ionizer
   

Outline:
NANO-MASTER offers Megasonic Single Wafer & Mask Cleaning Systems for the state of the art damage-free megasonic cleaning of substrates with the highest resolution patterns by controlling uniform distribution of the acoustic energy density across the entire surface of the substrate. Particle release off the surface is enhanced with chemical dispense and then the released particles are removed from the substrate surface allowing the least number of reattachments by sweeping off with the radial flow of the DI water. This patented technology provides reproducible and uniform cleaning of the wafers, masks, and other delicate substrates with maximum megasonic energy just below the damage threshold of parts to be cleaned.

 
         
 
 
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