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| Home » Products » Besi » Advanced Packaging Solutions for Semiconductor Industries |
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BESI has supplied semiconductor equipments to primarily leading
U.S., European and Asian semiconductor manufacturers, assembly
subcontractors and electronics and industrial companies including
Amkor, ASE, Chipmos, Epcos, Fairchild, Hynix, Infineon, Osram, UTAC, Robert Bosch, Samsung, Siliconware,
Skyworks, STMicroelectronics and Texas Instruments. BESI
equipment performs critical functions in their customers’ semiconductor assembly operations and in many cases represents a
significant percentage of their installed base of assembly equipment. |
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| Die Handling |
Packaging & Plating |
Wire Bonding |
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| ESEC WB 3100 (Wire Bonder) |
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The BESI Esec Wire Bonder 3100 plus is more than just a machine. It is a revolution. It has unique pivotingbondhead, it can break existing performance barriers, delivering unprecedented levels of speed and accuracy.The secret to this quantum leap in performance lies in ESEC Assembly Equipment's TY technology. This technology
makes use of entirely new kinematics, which offers higher acceleration with less vibration. But that is not all the 3100 plus has to offer. With its ergonomic design and multi-lingual GUI, it is singularly user userfriendly
and it is the cost leader. |
| Standard Configuration |
| Equipment |
| - TY Bond Head |
- Magazine Handler |
- Tunnel Buffer |
- Single Clamp Indexer |
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| Productivity / Process |
| Sprint UPH: 18 wires/second (depends on material/process requirements) |
| Max. Bond area: 52 mm x 70 mm / 2" x 2.75" |
| Bond Placement Accuracy: ±2.5 μm (3 sigma) |
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| ESEC DB 2008 (Die Bonder) |
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BESI Esec chose to develop a new high-speed platform for high-volume IC production: the 2008hS. This advanced
piece of equipment provides users with maximum throughput at minimum cost of ownership. The 2008hS can offer
a great deal more than most other die bonders. It has superior small die capability and the flexibility to handle a
wide range of leadframe and substrate applications. In addition, its newly developed pick-up process and innovative
constant force bondhead (CFBH) make shorter pick-up times and higher process quality possible. |
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| Achieved UPH for LFCSP32 : 10'100 |
-without optical bond centering
with optical bond centering |
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| Standard Configuration |
| Equipment |
| - High Speed Pick & Place |
- Constant Force Bond Head |
| - Pick Vision Motorised |
- Top Stack Loader |
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| Productivity / Process |
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| Achieved UPH for LFCSP32 : 15'500 |
- with 1 x 1mm blank die at 25μm BLTwithout optical bond centering
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| Die Placement Accuracy |
| Die size |
Accuracy |
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3 sigma |
1 sigma |
5 mm/
200 mils |
37.5 μm
0.375° |
12.5μm
0.125° |
2 mm/
80 mils |
0.6° |
0.2° |
0.5 mm/
20 mils |
1.2° |
0.4° |
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| Die size |
Accuracy |
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3 sigma |
1 sigma |
5 mm/
200 mils |
25μm
0.25° |
8.3μm
0.08° |
2 mm/
80 mils |
0.48° |
0.16° |
0.5 mm/
20 mils |
1.00° |
0.33° |
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| FICO Moulting System |
The AMS-i is an intelligent fully automatic molding system. It is designed for all current and future package
types, using any type of pelletized molding compound. Independent, flexible press operation, high reliability and
the shortest machine time in the market, guarantee high output. The flexible design allows easy incorporation of your specific requirements. |
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| Standard features |
| Besides a wide variety of additional options, the AMS-i is already equipped with many standard features: |
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clean room class 1000 |
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machine is CE compliant |
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user friendly touch screen |
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machine manuals available on the user interface |
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product lot tracking |
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leadframe orientation check |
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remote pellet feed with pellet length check |
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presses with 60 or 90 tons clamp force |
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unwanted object detection in the press to prevent damage |
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automatic board thickness compensation for BGA products |
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remaining cull detection when molded product are unloaded |
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large cull bin, can be emtied while the machine continues production |
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