| |
| Home » Products » Fuji » NXT-II Fuji Scalable Placement Platform |
| |
| HIGH-SPEED MULTI-FUNCTION MODULAR PLACEMENT MACHINE |
| |
The Fuji NXT designed to meet the demands of modern production
environments. Its interchangeable placement heads allow each machine
module to function as either a high speed chip mounter or a multifunction
placement machine and – enabling the changeover of a
complete production line in just minutes. NXT modules are rapidly
reconfigurable to ensure your ability to real-time production demands.
M3II , M6II and newly launched M6II SP (High Accuracy Module)
modules can be arranged and quickly rearranged to specifically fit your
unique and dynamically changing production environment. Horizontal
loading intelligent feeders not only allow components to be loaded
while the machine is moving they eliminate setup errors, as the ID
function ensures that components are delivered where they are needed
on the board. |
|
The NXT can accommodate PCB size upto 534 x 610 mm and is
equipped with automatic rail width adjustment and an optional
automatic tooling pin-support system. |
Intelligent Feeders are standard and can be quickly loaded into any
available slot, prevent component loss on reel changeover, and provide
remaining component and preventive maintenance administration.
NXT's language-neutral, icon based operating system minimizes the
learning curve for training operators, and improves efficiency of
operators running the line. This eliminates the typical implementation
issues with productivity and quality that offen accompany the
integration of new technology. |
Fuji introduces new technology for NXT platform, such as high accuracy
placement module M6II SP ( Mixed Placement Bare Die & SMD), Direct Die feeder, Tray feeder and H12HSQ, H08Q, H02 lacement
head for wide range of applications. |
| |
| Placement Accuracy |
High-precision placement accuracy is constantly maintained with automatic part camera, mark camera, and nozzle center
measurements. |
| |
| |
| User Interface |
The NXT's graphical user interface is simple and easy-tounderstand, minimizing time-consuming operator training. |
| |
| |
| |
| |
| Direct Die Feeder |
| DDF economizes cost by enabling
process integration for
placement for flip chip and bare
die placement with existing SMD |
| |
| |
| |
| |
| |
| Tray Feeder-M/L |
| Tray feeders can support 2-inch, 3-inch. 4-
inch and JEDEC Standard trays. Parts can
be supplied while tray feeder is set on the
machine |
| |
| |
| |
| |
| |
H12HSQ and H08Q Heads |
Head with IPS-Intelligent part sensor (Part recognition Function) makes it possible to check parts placement by looking for the part on the nozzle before and after placement. Sensor can also detect tombstone parts. |
| |
| |
| |
| Standard Specifications |
| Model |
M3II |
M6II |
| PCB Size |
Double Conveyor Type : 48mm x 48mm to 534mm x 510 mm
Single Conveyor Type : 48mm x 48mm to 534mm x 610 mm |
|
| Feeder Capacity |
Up to 20 types (8 mm tape) |
Up to 45 types (8 mm tape) |
| PCB load time |
Double Conveyor: Continous 0 sec, Single conveyor: 2.5 sec (Using only M3ll Module Single conveyor: 3.4sec (Using Only M6ll Module) |
| Placing Accuracy
(Fiducial mark based referencing) |
Chips:± 0.05 mm (3 sigma) four Side leaded: 0.03 mm (3 sigma) |
| Throughput |
H12HS : 22,500 CPH
H08 : 10,500 CPH
H04 :6,500 CPH
H02 :5,600 CPH
H01 : 4,200 CPH
|
H12HS : 22,500 CPH
H08 : 10,500 CPH
H04 :6,500 CPH
H02 :5,600 CPH
H01 : 4,200 CPH |
| Applicable Components |
H12HS : 0402 (01005) to 7.5 x 7.5mm Max Height : 3.0mm
H08 : 0402 (01005) to 12 x12 mm Max Height : 6.5 mm
H04 : 1608 (0603) to 38 x 38 mm Max Height : 9.5 mm
H02/H01 : 1608 (0603) to 74 x 74mm (32mm x 180mm) Max Height : 25.4mm |
| Module Width |
320mm |
645mm |
| Machine dimensions |
4Mll Base: L:1390mm x W: 1934mm x H:1474mm |
2Mll Base: L: 740 mm x W: 1934mm x H: 1474mm |
|
| |
| |
| |