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| Home » Products » Koh Young Technology » 3D Solder Paste Inspection |
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| WORLD'S BEST 3D SOLDER PASTE MEASUREMENT AND INSPECTION SYSTEM. |
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| [The common bottleneck for conventional
inspection systems.]
With single sided projection, all
irregularly-shaped objects have
shadowed areas that can result in
imprecise measurements. |
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| Using Koh Young's patented 3D inspection technology, the
Koh Young delivers true 3D inspection without concern for
inaccuracies resulting from shadowing. |
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| More powerful SPC toolkit |
Shortest Programming Time |
Koh Young SPC toolkit is intuitive, powerful and multi-featured.
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Efficient, friendly interface and
powerful conversion software lets
you spend your time inspecting, not
programming. You're done in less
than 10 minutes and there's no need
to debug or fine tune. This is
especially advantageous to manufacturers with a high product mix.
Why spend all your time programming when you can be generating
throughput instead?
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| Warped PCBs? No Problem! |
Accurate Extraction of Solder Pste Volume |
Don't let the occasional warped PCB slow you down or skew
your
results. Koh Young's unique real-time warpage tracking
hardware
and software ensures robust, uninterrupted
inspection of warped
boards up to ± 5mm. |
You need to know the exact volume of
solder paste deposited; to measure
that, your inspection equipment
needs to know where the PCB
surface ends, and where the paste
begins. Koh Young's 'smart'
technology has the ability to extract
true solder paste volume by 'learning'
board topography and creating a
reference; it always delivers a precise volume measurement. |
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| The Three Dimensions of Inspection |
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Defect Detection Capability |
Solder paste printing is a 3-
dimensional process. In order
to accurately measure printed
paste volume, 3D inspection
technology is needed. It's the
only way to 'see' print
problems and get reliable
information for SPC analysis
and process control. |
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Koh Young system are capable of detecting not only insufficient,
excessive solder pastes, bridging and position errors, but also shape
deformities including tailing and scraped errors occurring in normal
volume. |
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| Standard Specifications |
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KY8030-2 |
KY8030-3 |
| Inspection Speed |
15μm*
20μm*
25μm* |
N/A
30cm /sec (4.65 in /sec)
45cm /sec (6.98 in /sec |
45cm /sec (6.98 in /sec)
70cm /sec (10.85 in /sec)
N/A |
| Z Resolution |
0.37μm |
| Min. PasteDeposit Size |
15μm*
20μm*
25μm |
N/A
150μm (Rect.) 200μm (Circle)
200μm (Rect.) 250μm (Circle) |
120μm (Rect.) 150μm (Circle)
150μm (Rect.) 200μm (Circle)
N/A |
| Volume Repeatability |
<1 % at 3 sigma, <3 % at 3 sigma (on a PCB) |
| Height Accuracy |
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2μm (25μm* resolution) |
1.5μm (15μm resolution) |
| Camera |
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5MPix |
4MPix High Speed Camera |
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L |
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330 x 250 mm (12.99" x 9.84") |
510 x 510 mm 20.08" x 20.08") |
| Min. PCB Size |
50 x 50 mm (1.97" x 1.97") |
| PCB Thickness |
0.4 ~ 0.4 mm
(0.016" ~ 0.16") |
0.4 ~ 0.4 mm
(0.016 ~ 0.20") |
| Max. PCB Wt. |
1.0 kg (2.2 lbs) |
2.0 kg (4.4 lbs) |
| Machine Wt. |
500 kg (1102 lbs) |
550 kg (1213 lbs) |
| Bottom side clearance |
30 mm (1.18") |
| Electrical Supply |
200 ~ 240VAC, 50/60 Hz Single phase |
| Air Supply |
5 Kgf/cm |
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| Standard Specifications |
| Camera |
1MPix |
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| Z Resolution |
0.37μm |
0.15 mils |
| Inspection Speed at 20 μm |
3cm /sec |
0.47 sq. inch/sec |
| Volume Repeatability |
< 1% at 3 sigma, < 3% at 3 sigma (on a PCB) |
(on a KY Calibration Target)
Height Accuracy |
2μm |
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(on a KY Calibration Target)
Gage R&R (± 50 tolerance) |
<< 10% at 6 sigma |
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| Max PCB Warp Compensation |
±3.5 mm |
0.14 inch |
| Max Paste Height |
400μm |
15.75 mils |
| Min. Paste Deposit size |
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| at 20μm |
Rectangle |
150μm |
5.91 mils |
| Circle |
200μm |
7.87 mils |
| Max. PCB Size |
460 x 410 mm |
18.11" x 16.14" |
| Min. PCB Size |
50 x 50 mm |
1.97" x 1.97" |
| PCB Thickness |
0.4 ~ 0.4 mm |
0.16" ~ 0.16" |
| Machine Weight |
95 Kg |
209 lbs |
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