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| Home » Products » Speedline » ACCEL |
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| ADVANCED CLEANING SYSTEM |
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ACCEL has been a pioneer in applying innovative technology to batch
and small-footprint inline cleaning systems. Well-known for utilizing
centrifugal force to enhance cleaning and drying, ACCEL systems are
ideal for densely packaged assemblies and semiconductor
applications such as wafer bumping, flip chips, CSPs, BGAs, MCMs
and hybrids. The unique ability to clean and dry in tight spaces also
makes ACCEL systems ideal for medical, optical and precision
cleaning challenges. Unlike most small cleaners, ACCEL systems are
not based on "dishwasher" technology. These unique systems are
engineered to provide high performance, short cycle times, zero
discharge and the capability to use a wide variety of aqueous and
solvent-based cleaning media. |
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| MicroCel |
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Handles most cleaning solvents |
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Unparalleled cleaning -- Ionic contamination of 0.00 micrograms/
inch, surface insulation resistance greater than 1014
ohms/square, and no visible residue |
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Zero Discharge System automatically removes solvents from
used rinse water and returns to wash reservoir for reuse - no
drain is required |
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Typical cycle times from wash to dry: |
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PCB, BGA apps - 3.5 to 7 minutes |
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Flip-chip, bumper wafer apps - 7 to 15 minutes |
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Small footprint |
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| MicroLine |
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Integrated Flow Module provides 100% contaminant removal
and complete rinsing and drying of the part and the carrier |
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Zero Discharge System automatically removes solvents from
used rinse water and returns to wash reservoir for reuse - no
drain is required |
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Carbon and DI resin filter cartridges slide out for easy draining
and replacement |
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Touch-Free Cleaning - parts cleaned in trays or boats are
retained in their carriers by a smooth, continuous "ceiling" positioned a few thousandths of an inch above them |
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