| |
| Home » Products » Fuji » XP-243E |
| |
| COMPACT MULTI-FUNCTION MOUNTER |
| |
The XP-243E provides accurate placement
of small parts to larger odd-form
components in a compact footprint. Onthe-
fly vision inspection and optical
correction ensure the most accurate
placements. Fuji's new dual vacuum (V2)
nozzle holder performs exceptionally highspeed
nozzle changes of 0.3 to 0.8
seconds, minimizing changeover time -
even when a wide variety of nozzles are
being used. |
|
| |
| MS Vision Processing Algorithm |
| Fuji's Multi-step (MS) vision processing algorithm allows for high-speed
simultaneous image processing (XP-243E). Support for fine-pitch QFPs
(0.3 mm) to 45 x 150 mm connectors. 100% bump detection for CSPs and
BGAs. |
| |
| Auto-Calibration |
Automatic camera/nozzle center correction using precision glass
components ensures consistent placing accuracy. Auto-calibration is
performed during breaks in production elimination measurement
downtime. |
| |
| Lead Linearity Check |
| Lead lineartiy inspection support for
components such as QFPs, VQFs, SOICs
and connectors. |
| |
| Versatile Universal Mechanical
Chuck |
| Direct tray pick provides excellent support
for odd-form components. |
| |
| Standard Specifications |
| Model |
XP-143E |
| PCB Size |
Max. 457 x 356 mm , 50 x 50 mm, Thickness: 0.3 to 4.0mm
(
Including option) |
| Feeder capacity |
Front: Up to 40 types (8 mm tape) Rear (trays):
10 types on 10 shelves, 20 types on 10 shelves. |
| PCB Loading time |
4.2 seconds |
| Placing accuracy |
Chips: ± 0.05 mm (3 sigma), ± 0.1mm (6 sigma)
OFPs: ± 0.03 mm (3 sigma), ± 0.06 mm (6 sigma) |
| Throughput |
Chips: 0.43 seconds/component
ICs: from 0.56 seconds |
| Applicable parts |
0603 (0201) to 45 x 150 mm
max, height 25.4mm |
| Machine dimensions |
L: 1500 mm x W: 1560 mm x H:1537mm
(H: excludes signal tower) |
| Machine weight |
2,000kg |
|
| |
| |