Nismet Training Curriculum
Training Content
Week 1
Training Content |
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Class 1 | Introduction to Electronic Industry |
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Introduction Manufacturing Standards |
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Class 2 | Electronic Manufacturing process |
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Class 3 | Electrostatic Discharge |
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Week 2
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Class 4 | Open discussion / revision |
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TEST 1 |
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PCB Handling and Conveying system |
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Class 5 | PCB Handling and Conveying system Cont |
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Electronic packages and SMD devices |
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Class 6 | Electronic packages and SMD devices Cont |
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Printed Circuit Board and Terminology |
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Week 3
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Class 7 | Printed Circuit Board and Terminology |
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Open discussion /revision |
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TEST 2 |
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Class 8 | Screen Printer Equipment |
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Screen Printing Process |
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Thinky Mixure |
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Class 9 | Screen Printing Process |
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Screen Printing Process -Stencil Design |
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Open Discussion |
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Week 4
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Class 10 | Open Discussion |
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TEST 2 |
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Pick and place Introduction |
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Class 11 | Pick and place Feeders |
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Class 12 | P & P Placement heads |
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Week 5
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Class 13 | P & P Placement Nozzles |
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P & P vision system |
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Class 14 | Open Discussion / Revision |
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TEST 3 |
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P & P offline programing concepts |
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Class 15 | P & P Placement heads |
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Week 6
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Class 16 | Solder paste Inspection SPI |
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Class 17 | Reflow Heating Process Methods |
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Reflow Heating Process Methods |
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Class 18 | Open Discussion / Revision |
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TEST 4 |
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Reflow Solder Defects |
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Week 7
Training Content |
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Class 19 | Reflow solder Defects cont |
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Reflow profiling |
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Class 20 | Manual Assembly process |
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Class 21 | Wave Soldering Process |
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Solder defects |
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Week 8
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Class 22 | Selective Soldering |
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Open Discussion / Revision |
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Class 23 | TEST 5 |
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Aquous cleaning |
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Class 24 | Aquous cleaning Cont |
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Stencil and Misprinted PCB claening |
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Week 9
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Class 25 | PCB Depenalling - Router |
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Class 26 | PCBA Incircuit Testing Process |
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Class 27 | PCBA Rework process |
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Week 10
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Class 28 | Open Discussion and revision |
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TEST 6 |
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Class 29 | X Ray Process |
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Handling MSD Components |
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Class 30 | Conformal Coating process |
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Week 11
Training Content |
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Class 31 | Plasma Technology Process |
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© | 2019 NMTRONICS | Designed By CFCS