Heller Industries was founded in 1960 and pioneered convection reflow soldering in the 1980s. Over the years, Heller has partnered with its customers to continually refine the systems to satisfy advanced applications requirements. By embracing challenge and change, Heller has earned the position of world leader in Thermal Process Solutions. Heller is the market leader in reflow oven technology, fluxless reflow technology, and curing oven technology, supplies solutions for electronics manufacturers and semiconductor advanced packagers worldwide.

Its advanced manufacturing and production systems supply both standard and special ovens cost-efficiently, with rapid delivery. These capabilities are supported by corporate and fiscal strength, the result of consistency in management policies and engineering expertise for over 60 years. With the Largest Engineering Team in the industry, HELLER has the capability to quickly deliver special thermal processing solutions and provide your businesses with a competitive advantage!

(Integrated with Industry-Leading Thermal Technology)

The new MK7 reflow oven is a platform that revolutionizes the industry with several new ground breaking designs and incorporates all of the customer requests for lower Delta T, reduced nitrogen consumption and extended PM into a new low height package that makes it easy to see across the production floor.

1. Superior Thermal Performance for Heating and Cooling

The MK7 platform offers superior thermal performance for both heating and cooling processes, revolutionizing the reflow industry with groundbreaking designs.

2. Consistent Thermal Profiles & Low Delta T’s with Low Energy Consumption

Excellent thermal performance is achieved with improved designs for heating and dynamic control, while energy usage is reduced with improved sealing and insulation. The Energy Management System on MK7 ovens provides smart control when off-loading of production to further save energy consumption.

Energy Management System on MK7 ovens provides smart control when the production line is idle to further save energy consumption.

3. New Designs Minimize Preventive Maintenance Effort & Time

4. Energy-Efficient Designs for Low Carbon Footprint

Heller takes low-carbon, green and sustainable development as the company's long-term goals, while meeting the technical requirements of customers, and spares no effort to apply green environmental protection technology to products, helping enterprises and the world to achieve carbon peaking goals.

5. Smart System for Smart Manufacturing

Digitalization is changing all areas of our lives, and manufacturing is no different. Manufacturing companies must move with this trend by adopting smart manufacturing processes in order to stay competitive. While the ultimate goals of fast delivery, low cost and high quality have remained unchanged, the management and analysis of data from production, process and equipment is now essential. HELLER understands this, and our software tools fully support smart manufacturing and Industry 4.0 .

HELLER ovens are smarter ever than before with integrated HW & SW. This enables operators to monitor the process in real-time to quickly improve product quality and yield, while reducing costs. HELLER 365 provides live oven monitoring of the thermal process on board level to ensure they are under control and within specification. All data is saved which allows users to look back at previous production and process data.

6. Configurable Designs for Your Application

Electronics Manufacturers demand a high level of productivity—providers are pushed to offer better results while maintaining profitability. To grow your business, you need a flexible system that can accommodate products and applications for SMT and Semicon. The MK7 is capable to serve a wide range of products and applications, giving you a competitive advantage to expand into new lines of business.

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Heller Industries offer vacuum reflow ovens with several different footprint and vacuum chamber size options, and are suitable for all volumes of production from R&D to HVM.

Drivers for High Reliability Production

Rapidly growing markets such as Automotive Electronics, LEDs, and Power Electronics are seeing a higher demand for device performance with increasing reliability standards. Manufacturers now need to solder void-free in order to meet these reliability standards.

Vacuum reflow soldering remains one of the best approaches for reducing solder void rates.

Factors that Affect Voids and Void Types

There are various types of voids which can form in SMT solder joints, such as macro voids, shrinkage voids, IMC voids and design-induced voids. Of these, macro voids (also called process voids) are most commonly seen, and can be caused by issues related to solder paste, PCB and component, or SMT processes.

Principle for Void Removal by Vacuum

Flux or moisture can outgas during solder reflow creating a bubble or void in a soldering joint. Vacuum assisted reflow can remove these voids by applying vacuum to a solder joint during the reflow process.

Good to Know Facts

The HELLER Vacuum Reflow Oven utilizes a vacuum chamber placed in the oven's reflow zone, which provides a controlled pump down (up to 5 separate steps with closed-loop pump control) resulting in significant reductions to void rate (>1% for many applications) with zero solders platter. The horizontal, in-line architecture makes it suitable for automated high throughput production.

Key Factors for Vacuum Reflowing

HELLER vacuum ovens have the hardware capabilities to ensure the highest process quality.

1. Sealing Performance

High Sealing Performance of HELLER Vacuum Chamber

2. Heating Capability in Vacuum Chamber

Shorter Time Above Liquidus with IR Chamber Heating

HELLER vacuum IR heaters enable temps as high as 450°C, and allow peak inside vacuum chamber

3-zone IR panel inside vacuum chamber

3. Vacuum Capability and Vacuum Control

Closed Loop Pressure Control Prevents Splatter and Solder Balls

4. Transportation Control

HELLER offers an ultra-smooth transportation system to ensure extremely low board vibrations during transport minimizing the risk of defects related to shifting parts.

Multi-Stage Conveyor System for High UPH

HELLER's new high-UPH multi-stage conveyor system dramatically increases throughput by utilizing 5 independently controlled conveyor systems. The oven's staging conveyors move boards quickly into and out of the vacuum chamber, reducing cycle times buy up to 50%. For typically use cases, throughput improvements of 85% or more can be seen. Additionally, the system has a separate cooling conveyor which can be slowed down to increase cooling time leading to much lower board exit temperatures.

Board Aligner for High Utilization

Productivity can be further improved by using a dual lane vacuum system with HELLER's dual lane board aligner. The board aligner accepts and holds upstream boards until both boards are aligned before allowing them to enter the oven at the same time, optimizing utilization of the vacuum chamber. Say goodbye to productivity setbacks caused by misalignment, and experience seamless board movement every step of the way.

Vacuum Oven Specification