Why Momentum BTB
- Identical single-lane printers are easily re-deployed to other lines when needed
- Maximum PCB size 609.6 mm x 508 mm (24” x 20”) [When running in dual lane configuration]
- Wet print accuracy of 20µm@6σ, Cpk ≥ 2, with 6σ Capability designed in and independently verified
- Smaller footprint - BTB 1.4 meter deep (55”)
- Overall length of 2.8m for the two machines
BENEFITS & FEATURES
Patented Single Camera Vision Alignment System
- MPM's Patented Look-Up/Look-Down technology ensure board-to-stencil alignment is accurate and repeatable
- No moving optical parts guarantee durability and reliability
- Flexibility to recognize unlimited number of fiducial image patterns through enhanced vision recognition strategies
Benchmark Software
- Window Operating System anchors Speedline's "Benchmark" software standard offering stability and ease of use
- Software developed, tested and released from Speedline Headquarters. No third party development ensuring software integrity
- Easy programming and on-board software wizards make programming and operation simple and efficient
- Touch screen friendly option available
Patented Ultrawipe Stencil Cleaner
- Patented solvent bar delivers maximum control of solvent application increasing yields
- Paper over plenum design reduces maintenance by filtering particles through the paper
- Provides unassisted cleaning of the bottom of the stencil for maximum uptime and increased yields
- Improved paper routing for fast and easy change-over
- Low noise Vacuum pump housed within the printer frame
Closed-Loop Squeegee
- Motor Driven Squeegee System provides maximum force control
- Patent pending "calibration compliance routine" automatically compensates for varying blade length and stiffness to ensure consistent force
- Patent pending close loop squeegee option provides the highest level of accuracy and responsiveness
Post Print Inspection
- Contrast based 2D pad inspection, bridge detection and under stencil inspection to increase quality and yield
- Inspection results are quantified to the component pad level and on-board SPC makes analysis clear and precise
- Speedline's patented texture based inspection sees paste between pads and surrounding stencil apertures to prevent defects
EnclosedFlow Print Head
- Excellent print results for fine feature devices
- Tremendous savings on print media compared to squeegee blades
- Ability to address a wide range of applications and materials
- Considerable technology advantages over current enclosed print media solutions
EdgeLoc® Snugging System
- MPM's EdgeLoc board clamping system takes board handling to the next level
- The EdgeLoc system uses software controlled pressure for the optimal board holding force, and automatically adjusts to match the programmed board thickness
- This unique solution firmly holds the board without the use of top clamps; delivering optimal stencil to board gasketing which is proven to yield higher paste release efficiency and reduced need for under stencil wiping
RapidClean
- A high speed stencil cleaning solution that improves stencil cleaning performance and reduces cycle time when using solvent
- RapidClean’s advanced plenum combines a vacuum and solvent stroke into a single wiper stroke
- Reduce 3 wipe strokes to 2 for a solvent, vacuum and dry cycle, which is the most effective cleaning sequence
- When using solvent, RapidClean reduces stencil cleaning cycle times by 5 – 6 seconds over the standard wiper
Paste Height Monitor
- Effective solution designed to prevent defects caused by inadequate paste on the stencil
- Utilizes advanced software and sensor technology for monitoring the paste bead for volume consistency
- When a low paste level is detected, paste can be added automatically using the dispenser or manually
- Easy to use, robust and highly accurate
Adjustable Stencil Adapter with Pneumatic Clamping
- A cost effective, easy to use solution for customers that need to handle different size stencils
- X - 20" (500mm) to 25.6" (650mm)
- Y - 20" (500mm) to 25.6" (650mm)
- Thickness: 0.39” (10mm) to 1.25” (32mm)
- Can accommodate tubular frame stencils, cast frames and space saver stencils
- Simply remove the adapter to use 29" x 29" stencils
- For smaller stencil sizes, the adapter can stay in the machine and you simply need to slide the stencil in and out when changing stencils
SPI Print Optimizer
- Produce consistent & accurate print results
- Reduce or eliminate operator “tweaking”
- Prevent defects instead of just identifying them
- Compensates for uncontrollable or difficult to control process variables
Specifications
Maximum Board Size (X x Y)
609.6 mm x 508 mm (24” x 20”) (Dedicated workholder required for boards with an X size greater than 20”
Minimum Board Size (X x Y)
50.8 mm x 50.8 mm (2” x 2”)
Board Thickness
0.2mm (0.008") to 5.0mm (0.20”)
Maximum Board Weight
4.5 kg (9.92 lbs)
Board Edge Clearance
3.0 mm (0.118")
Underside Clearance
12.7 mm (0.5") standard Configurable for 25.4 mm (1.0”)
Board Hold-Down
fixed top clamps, centernest vacuum, Optional EdgeLoc
Board Support Methods
Centernest vacuum, Magnetic pins, vacuum pins, support blocks, Optional fixtures (tool-less) or Optional Grid-Lok
Maximum Print Area (X x Y)
609.6 mm x 508 mm (24" x 20")
Snap-off Speed
Programmable
Snap-off Distance
0 - 6.35 mm (0 - 0.25")
Print Speed
.635 mm/s - 304.8 mm/s (0.025 in/s - 12.0 in/s)
Print Pressure
0lb to 50lb (0kg to 22.7kg)
Modes Available
Dry bottom clean, Wet bottom clean, Vacuum aperture clean
Wipe Stroke
Full print area
Programmable frequency
Up to 1000 boards
Number of wipe cycles per wipe
Up to 10
Wipe on 2D failure
Automatic
Vision Field-of-View (FOV)
10 mm x 8.0 mm (0.39" x 0.31")
Fiducial Types
Standard shape fiducials (see SMEMA standards), pad/aperture
Camera System
Single camera - patented look up/look down vision
Total Process Alignment Repeatability and Accuracy
±12.5 microns (±0.0005") at 6 Sigma, Cpk greater than or equal to 2.0
Wet Print Deposit Accuracy and Repeatability
± 20 microns (±0.0008") at 6 Sigma, Cpk greater than or equal to 2.0
Machine Height (excluding light tower)
1589.4 mm (62.57") at 940 mm (37.0") transport height
Machine Depth
1394 mm (54.88")
Machine Depth
1195.4 mm (47.06")
MPM-100
11 Seconds
Momentum BTB
9 Seconds
Momentum HiE BTB
7.5 Seconds
