With over 1300 installed soldering systems, INERTEC is one of the leading companies in this market sector. Right from the start, the main focus was on the development and production of innovative soldering technologies. The corporate guiding principle was and still is today the company´s ability to react flexibly to the wishes and requirements of the user, and to continue to develop innovative products.
One of the outstanding features of these soldering systems is their ability to combine flexibility and throughput. The continuous further development of these systems ensures utmost quality, productivity and investment security. Our objective is to offer the customer a solution that will offer them a return on their investment as quickly as possible. If the standard systems do not always suit, we will coordinate with the customer to create bespoke solutions - from rotary indexing through to logistical links.
Our services range from consultation and planning through to supply, assembly and a reliable on-site service.
The satisfaction of our customers is our greatest objective. We demonstrate this with our state-of-the-art, innovative soldering machines, the quality of our products and our orientation to customer requirements. Our qualified service team installs the machines, trains your employees and helps you to introduce the process.
The spare parts supply is carried out directly from Kreuzwertheim or from the warehouses of our individual service partners. Thanks to the consistent standardization, many parts are also identical for different system types, therefore facilitating warehousing. We always aim to have spare parts sent out to customers within 24 hours, making sure they can get their system back up and running as quickly as possible.
The new CUBE 460 entry-level soldering system is designed as a production cell for small and medium batch sizes. With the loading shuttle, it is possible to perform THT assembly directly on the machine, at the same time as significantly improving quality when compared to manual soldering.
The simplified graphical programming gives you a quick entry into selective soldering technology. Benefit from the professional functions and proven technology available in the larger systems, such as process monitoring or bus-capable DC servomotor.
Circuit boards or components up to 460 x 460 mm, with or without lead content, are processed with quick-change, flexible soldering nozzles. In the design, particular attention has been paid to simple setup and maintenance, through good accessibility.
The capability of setting the soldering angle to 0° and 7° with program control makes it possible to use various soldering nozzles under optimum conditions for each one. This means difficult layouts can often be achieved, with ultra-narrow clearances.
The CUBE 460 is excellently suited to using various solders when our set-up carriage is employed. Increase your throughput and flexibility by a second soldering module with program-controlled stroke.
An electro dynamic pump is available as an alternative to the standard soldering pump.
The standard microdrop fluxer achieves a precise application pattern for fluxing with very few residues.
The process observation camera helps you to optimize the process.
High-performance quartz pre-heating guarantees efficient pre-heating and low energy consumption.
Dimensions with shuttle | L 2000 mm; W 1550 mm; H 1250 mm (79“ x 61“ x50“) | |
Dimensions without shuttle | L 1430 mm; W 1550 mm; H 1250 mm (57“ x 61“ x 50“) | |
Weight | Ca 800 kg | |
Colour | base frame RAL7035; door panel RAL7021 | |
Exhaust opening | Ø150 mm (6“) | |
Extraction rate | 400m³/h | |
Power requirements | 3x32 A; 3x400V; 50 Hz;6KW | |
System control | ||
---|---|---|
Control concept | PC; Beckhoff PLC | |
Interface | Ethernet, USB | |
USV | Optional | |
PC | PC; Flat screen monitor; keyboard; mouse | |
Offline software | Offline software for easy programming | |
Axis type | XY-Portal; Z-axis lift | |
Camera | Camera with cross hair for online programming | |
Axis movement | Combination of toothed belts and ball screw | |
Drive concept | DC Servo motors with encoders; CAN-BUS | |
Repeatability | ±0,15 mm (±0,006“) | |
Board size | ||
Dimensions min/max | 20x20 mm / 460x460 mm (0,8“x0,8“ / 18“x18) | |
Soldering angle | 0° | |
Soldering angle | 0° oder 7° | |
Bottom side clearance | 30 mm (1,2“) | |
Top side clearance | 150 mm (6“) | |
Carrier | Special fixtures available, downholder, etc. | |
Flux System | ||
Fluxer type | Micro Drop | |
Flux | Alcohol based with 5% solids recommended | |
Flux container | 3 litre pressurised pot with level indicator | |
Second flux pot for different flux type available | ||
Preheat | ||
Type | Quartz Rods | |
Power | approx. 4 KW | |
Top side preheat | Built into the gripper | |
Solder Pot | ||
Solder pot (big size) enables to add a second mini wave module | Solder volume lead-free (45 Kg) / leaded (50 Kg) | |
Using two small solder pots enables to operate with different alloys | Solder volume lead-free (21 Kg) / leaded (24 Kg) | |
Solder pot with a wave module = 200mm | Solder volume lead-free (58 Kg) / leaded (66 Kg) | |
Additional mini wave module | For parallel soldering or in combination with the module lifting different nozzles can be used in one programm | |
Additional nozzle heating | High performance additional nozzle heating including temperature controller | |
Additional solder nozzles | Different sizes are available Ø4 mm - Ø20 mm (0,02“ – 0,08“) | |
Wetted (multi directional) nozzle | Different sizes are available Ø4 mm - Ø20 mm (0,02“ – 0,08“) | |
Warm up time | Circa 45 minutes | |
Solder temperature | Maximum 330°C | |
Solder temperature control | solder aggregate | |
Solder wave height control | Programm controlled | |
Solder wire feeder | Motor driven up to 1,5 - 2mm (other sizes on request), solder wire max 5 kg | |
Nitrogen inerted | Nitrogen quality, 5.0 is recommended, max pressure 5,5 bar | |
Nitrogen consumption | Depending on User soldering nozzle 1-3 m3/ hr | |
Process Camera | Camera „real time“ to view the soldering process | |
Trolley and Exchangeable solder pot | Exchanging of the soldering aggregate for the use of different alloys | |
Electro-dynamic solder pump | Alternative to a standard rotarydrive pump |
Standard Optional
Highest quality, flexibility and efficiency is what you get with our new Selective Soldering System CUBE Inline.
The basic construction of the CUBE Inline has the possibility to work simultaneous in the areas fluxing, preheating and soldering. Preheating is always a special challenge, especially with lead free solder and thermal challenging printed circuit boards. For this reason the CUBE Inline has as standard equipped with a quick reacting quartz heater.
High attention has been paid to the convenience and the ease of use of the programming Software. The offline programming can use Gerber files as well as jpg files. The CUBE software has functions such as auto routing and scheduled maintenance reminders that makes the production day easier.
The preheater covers the full process area of 510 x 460 mm and guarantees a constant – and via an optional Pyrometer – controlled heating of the PCB.
As an independent module it can be equipped with various combinations for example with a bottom / top side heater and quartz and with convection support if required. During the soldering process the optional top side heater will allow an efficient heat to assist the soldering of high thermal mass PCB´s
The wave height is measured and adjusted via a titanium needle.
The possibility of having two solder aggregates allow you to handle two different alloys or the possibility of operating different nozzle sizes.
The hot gas nitrogen together with the new style soldering nozzle supports the soldering process with a constant local preheat. The process camera gives a perfect view of the soldering process and is a perfect tool for the process optimization. Additionally the camera makes the programming easier and saves time as well as money.
Highest reliability and precision with the option of the Fiducial Correction. The optional warpage sensor measures the warpage of the PCB after the preheat and corrects the z-height automatically.
The new design enables a fast change over of the solder nozzles.
The unit can be dismounted very easily during maintenance or a product change. If products need to be soldered with other nozzle sizes only the tip of the nozzle needs to be changed.
Dimensions | L 3000 mm; W 1550 mm; H 1310 mm (119“ x 61“ x 52“) | |
Colour | Base frame RAL7035; door panel RAL7021 | |
Exhaust opening | 3 ports - Ø 150 mm (6“) | |
Power requirements Europe | 3x32 A; 3x400 V; 50 Hz; 22,5 KW | |
Power requirements US | 3x63 A; 3x208 V; 60 Hz; 22,5 KW | |
Including | Top Side heat, Solder aggregate, Hot Gas Nozzle Heating | |
System Control | ||
---|---|---|
Control concept | PC; Beckhoff PLC | |
Interface | Ethernet, USB | |
UPS | Optional | |
PC | PC; Flat screen monitor; keyboard; mouse | |
Offline Software | Offline software for easy programming | |
Axis type | XY-Portal; Z-axis lift for the soldering units | |
Camera | Camera with cross hair for online programming | |
Axis movement | Combination of toothed belts and ball screw | |
Drive concept | DC Servo motors with encoders; CAN-BUS | |
Repeatability | ±0,15 mm (±0,006“) | |
Board size | ||
Dimensions min/max length x width | Min. 80 x 50 mm/ max. 510 x 460 mm | |
Soldering angle | 0° | |
Bottom side clearance | 20 mm standard | |
Top side clearance | 100 mm (3,94“) | |
Pin chain conveyor | Segmented conveyor with 3 mm edge clearance | |
Carrier | Universal carrier or special fixtures with an integrated downholder available | |
Flux System | ||
Fluxer type | Micro Drop | |
Fluxer type | Spray fluxer or SONOTEK ultrasonic type | |
Flux | Alcohol based up to 5% solids recommended | |
Flux container | 3 litre pressurised pot with level indicator | |
Flux container | Second flux pot for different flux type available | |
Preheat | ||
Type | Quartz Rods | |
Top side preheat | Additional heater above the standard bottom preheater or above the soldering area | |
Solder Pot | ||
Solder pot | Lead-free / leaded | |
Solder pot (lead-free) | approx. 25 kg | |
Solder pot (leaded) | approx. 30 kg | |
Additional mini wave module | For parallel soldering | |
Additional nozzle heating | High performance additional nozzle heating including temperature controller | |
Additional solder nozzles | Different sizes are available Ø4 mm - Ø20 mm (0,02“ – 0,08“) | |
Wetted (multi directional) nozzle | Different sizes are available Ø4 mm - Ø20 mm (0,02“ – 0,08“) | |
Warm up time | approx. 45 minutes | |
Solder temperature | Maximum 330°C | |
Solder temperature control | PID controlled | |
Solder wave height control | Program controlled via titanium pin | |
Solder wire feeder | Motor driven up to 1,5 - 2mm (other sizes on request), solder wire max 5 kg | |
Nitrogen inerted | Nitrogen quality, 5.0 is recommended, pressure max. 5,5 bar | |
Nitrogen consumption | Depending on User soldering nozzle 1-3 m3/ hr | |
Process Camera | Camera „real time“ to view the soldering process | |
Trolley | For the exchange of the soldering aggregates |
Standard Optional
The ELS 3.3 soldering system has been designed for the production mix of small and medium series. The easy-to program mini waves with wettable and contra flow nozzles enable any subassembly to be processed using optimized parameters.
Hundreds of INERTEC multi-axis soldering systems from the ELS series have been used since 1993 in electronics productions worldwide.
These soldering systems enable virtually all manual soldering applications to be automated. The soldering quality is on a par with that of forming gas mass soldering systems. This system, which is preferred by numerous well-known electronics service providers, offers a solid design and simple programming.
Using the soldering nozzle quick-change system, the unit can be modified with just a few hand movements to handle the most varied of soldering tasks. A precise control of the soldering heights and temperatures forms the basis for the reliable process controls required by the user.
The soldering module that is supplied with two simultaneous or autonomous soldering modules ensures the maximum technological availability for all products; large connectors or point soldering – not a problem for this system. An interchangeable soldering module and a transportation unit are also available upon request. The use of lead-free solder is obligatory and the soldering module is enamelled throughout.
The soldering module is equipped with an axis-controlled flux system and a multi-stage glass ceramic pre-heating system specially developed for subassembly production.
The ELS 3.3 soldering system is designed as a soldering centre for inline operation with a connection to external transport systems. For special applications, the soldering unit can be expanded so that the crucible can take up to 4 waves in parallel.
Thanks to the solid construction of the soldering unit and the professional X-Y-Z axes system with servo drives, high piece weights can be processed. It is therefore possible to integrate this in the alignment and hold-down functions of the gripper. Thanks to the inline design of the indivdiual components, fluxing, pre-heating and soldering, 3 pallets can be processed in the system and the processes managed separately from each other in a cycle-neutral manner. A pin chain transport is installed above the fluxer and the pre-heating system for this purpose. A 40-mm soldering wave can be used for soldering work on small subassemblies.
Take your pick from a multitude of interchangeable nozzles to suit those special soldering tasks. We have the ideal solution for virtually all your soldering needs.
The ELS 3.3 Inline is the ideal solution if you require flexibility and throughput. Its intelligent soldering modules make it unnecessary to change nozzles or you can use several soldering nozzles in parallel. It can also operate with 2 solder crucibles containing different solders simultaneously – you can even use a full wave. The ELS 3.3 therefore sets new standards in terms of flexibility and throughput.
Increased quality demands in the automotive sector call for a qualified soldering process, with the respective process controls and batch traceability – an evident advantage of this automated solution. The ELS 3.3 is perfectly prepared – with its diverse traceability concepts from simple barcode detection through to complex main computer connection.
Today, the efficiency of the software plays a significant role. How quickly can I implement my project? Well, if you have the right tools … in next to no time. Offline – generate the basic program with ease, either graphically using the workplace or by means of Gerber files. Already at this stage you can optimize process paths, calculate cycle times and launch a simulation run. You then simply adapt the process parameters on the machine´s computer to suit the circuit board – job done.
EMLS3235 is the most powerful soldering system offered amongst our selective soldering systems. The unique solde-ring system is based on product-specific soldering requirements, applying solder to all locations simultaneously with very high quality and unmatched repeatability.
You will notice a considerable increase in productivity regardless of the number of components being soldered. This is achieved by the use of multiple individually built nozzles. Fluxing will not become the bottleneck as this is also achieved by a tool based delivery system touching all points simultaneously depositing the precise amount of flux. This is a robust solution for the fluxing process regardless of the caustic environment. If an increased through-put is required, additional flux, pre-heat, and soldering modules can be easily added.
Moreover, the new innovative tool changeover concept in combination with a trolley makes the product change simple, safe, and quick with changeover times often less than 5 minutes.
The soldering process features a skimming step that takes place in a nitrogen inerted atmosphere. This guarantees a perfectly clean solder tool during the solder process. The skimming step takes place while the solder tool is completely immersed in the solder bath (when not in use) to prevent dross and contamination buildup on the tool.
Inertec supports your soldering application from the very beginning. All aspects of the service and support are project managed.
From tool design, to the soldering process, and over 20 years of soldering experience Inertec takes great care and pride in developing all types of through-hole solutions.
Dimensions | L 3100 mm (3T); 4200 (4T); B 1500 mm; H 1850 mm (122“ (3T); 165“ (4T) x 59“ x 73“) | |
Weight | Ca 2500 kg | |
Colour | base frame RAL7035 | |
Exhaust opening | 3 ports Ø200 mm (7,8“) | |
Extraction rate | 800 - 1000 m³/h | |
Power requirements | 3x32 A; 3x400V; 50 Hz; 30-40KW depending on the mechine version | |
System Control | ||
---|---|---|
Control concept | PC; Beckhoff PLC | |
Interface | Ethernet, USB | |
USV | Optional | |
PC | PC; Flat screen monitor; keyboard; mouse | |
Software | INERTEC HMI | |
Tracebility | customized on the current systems | |
Axis movement | Combination of toothed belts and ball screw | |
Drive concept | DC Servo motors with encoders; CAN-BUS | |
Repeatability | ±0,15 mm (±0,006“) | |
Board size | ||
Dimensions min/max | 320 x 350 mm (12,6“ x 13,8“) | |
Bottom side clearance | 20 mm (0,8“) | |
Top side clearance | 100 mm (3,9“) | |
Pin chain conveyor | Segmented conveyor with 5mm edge clearence | |
Carrier | Special fixtures available, downholder, etc. | |
Stamp Fluxer | ||
Flux tooling with servo axis | tolling with brushes fitted | |
Downholder | Compressed air | |
Flux | Alcohol based with max.10% solids recommended | |
Flux container | Ca. 25 litre pot with level indicator | |
Option XY - Fluxer | ||
Fluxer type | Micro Drop | |
Flux | Alcohol based with 5% solids recommended | |
Flux container | 3 litre pressurised pot with level indicator | |
Second flux pot for different flux type available | ||
Preheat | ||
Type | Quartz Rods; infrared; covection | |
Solder Pot | ||
Solder pot | Solder volume: lead-free / leaded 550 - 600 Kg | |
Warm up time | Ca 3 h | |
Solder temperature | Maximum 330°C | |
Solder temperature control | solder aggregate - PID controler | |
Solder feeder | max 5 kg | |
Nitrogen inerted | Nitrogen quality, 5.0 is recommended, max pressure 5,5 bar |
Standard Optional